SP3-C helps customers experience the printer of the future smart era as well as the best printing quality
· Realizes high-precision printing with alignment accuracy of ±8um
· Corrects print offset automatically by feeding back defective SPI printing
· port for Mixed Production
Align Repeatability±8um @ 6σ
Wet Print±15um @ 6σ
Cycle5sec (Excl. Printing )
Board Handling (mm)Max. L350 × W250 (Single Lane) / L350 × W250 (Dual Lane/Option)
Stencil (mm)L550 × W650/L650 × W550 ~ L736 × W736
Best Quality
Printing Technoy
Allows printing in the direction of both X and Y axes and realizes the best printing quality by applying SQG Blade Tilting Technoy.
2D Inspection
Prevents Defective Printing
Possible to per 2DI of a PCB for insufficient soldering, excessive soldering, and solder bridges as well as foreign materials.
SPI Feedback System
Improves Printing Quality
Corrects the printing offset automatically by feeding back to the machine the data inspected by the SPI machine.
Cleaning Technoy
Improves User Convenience and Cleaning Perance
Improves the user convenience of the Cleaner Module and increases cleaning perance by applying the Solvent Dipping technoy.