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Flip-chip die bonder SFM5high-accuracy
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Characteristics
- Options
- high-accuracy, flip-chip
Description
High-Accuracy & High-Speed machine confirmed with global IDM demos.
Configuration8 Head (2Gantry x 4Head)
Productivity15,000 UPH
Accuracy±4um @ 3σ
ForceMax. 30N
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.