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Flip-chip die bonder SFM5
high-accuracy

Flip-chip die bonder - SFM5 - HANWHA - high-accuracy

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Characteristics

Options: high-accuracy, flip-chip

Description

High-Accuracy & High-Speed machine confirmed with global IDM demos. Configuration8 Head (2Gantry x 4Head) Productivity15,000 UPH Accuracy±4um @ 3σ ForceMax. 30N

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Flip-chip die bonder SFM5high-accuracy

Characteristics

Description

Other HANWHA products

SMT

Flip-chip die bonder SFM5
high-accuracy