MX300C series is an automated thermal characteristics test system for power semiconductor. It consists of sampling unit, temperature control unit, power supply unit and system control unit. It is mainly suitable for power cycling test and thermal resistance test of power semiconductor such as IGBT(Si/SiC/GaN materials), MOSFET, DIODE, and etc., to evaluate the performance of power semiconductor during service life.
Functions
Power cycling test
Thermal resistance test/Transient thermal resistance test (Rth/Zth)
The K Curve test
Junction-to-case thermal resistance (RJC)
Gate leakage current test (IGES)
Product Advantages
High accuracy for constant temperature plate.
Real-time fault diagnosis function.
Remote monitoring function.
Multiply protection: over-temperature, smoke alarm, coolant leakage detection, and etc.
Compatibility: IGBT/DIODE/MOSFET/BJT/SCR test.
UPS power supply system: ensure system and data security under power off condition.
. Power cycling test
. Thermal resistance test/Transient thermal resistance test (Rth/Zth)
. The K Curve test