Process autoclave 1936 MKV

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Flux-Free Formic Reflow Soldering Flux-Free Formic Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution Feasibility has been demonstrated with production grade oven Extensive engineering efforts in safe, precision delivery of formic acid and abatement Flux-Free Formic Reflow Advantages Can use any reflow profile (e.g., tent or soak profile) with formic acid Can adjust formic acid profile in oven in conjunction with thermal reflow profile Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards Includes Formic acid abatement systems for Green Process Solution Includes real time formic acid concentration monitor system Formic Acid Precision Bubbler Cabinet Bubbler designed to provide consistent, reliable formic acid vapor concentration Formic acid vapor concentration saturates nitrogen according to Antoine equation for a given temperature Formic acid vapor concentration in the oven can be varied by bubbler temperature and nitrogen flow through bubbler Bubble size is engineered with diffuser plates