Reflow soldering oven 1707 Mk5

Reflow Oven -1707 Mk5 Best value SMT Reflow Oven in the market. Designed for Low Cost of Ownership. The 1700 reflow oven models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. Highest Yields and Tight Process Control The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy printed circuit board loads. Wide process window for “universal profiling” – allows many different printed circuit boards to be run on a single temperature profile Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 reflow profile graphs Features and benefits of 1707 SMT reflow system New Flux System Virtually Eliminates Maintenance This new flux collection system traps the flux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean – thus saving time consuming P.M. A collection jar captures the pcb flux and can be removed while the reflow oven is running for the ultimate in time savings! Enhanced Heater Modules Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally,