Wafer measurement system XDV®-µ SEMI

coating thicknessX-rayautomatic

First choice for automated wafer measuring. Special device for automated measuring and analysis of smallest structures, very thin coatings and multilayer systems on wafers with diameters up to 12 inches. Precise XRF measuring of microstructures on wafers. The FISCHERSCOPE® X-RAY XDV®-μ SEMI is the optimal measuring solution for fully automated inspection of microstructures on wafers. The automated wafer handling and inspection process ensures a very high efficiency and enables error-free handling and measurement of wafers due to consistent inspection conditions through an encapsulated inspection environment. The powerful detector, microfocus tube Ultra and polycapillary optics for smallest measuring spots guarantee an outstanding measuring performance. The automation solution is available as a pre-engineered solution. Benefit from an existing hardware and software design. Together we modify and adapt the automation device according to your requirements. Fully automated. Developed as a self-runner for a programmable, smooth measuring process Smart details for usability. Integrated CCTV monitoring of the complete handling process Easy maintenance. Large service hatches for access to individual components DPP+ digital pulse processor. Shorter measuring times or improvement of standard deviation* Clean room compatible. No contamination of the wafers as well as constant measuring conditions Programmable. Automatic recognition and approach of the measuring points Most advanced polycapillary optics on the market. Our in-house manufactured polycapillary optics deliver outstanding measurement results with short measurement times