- Electricity - Electronics
- Electronic Component
- Henan Shijia Photons Technology Co., Ltd
Silicon wafer
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Description
SHIJIA’s optical splitter wafer is developed by using planar light wave circuit technology. Its different channel is fabricated on the quartz through growing, lithography, etches and other
process. The high reliable optical splitter chips can be obtained through lid glass bonding, cutting, grinding, and polishing process.
Features:
● 6 inch size
● Low insertion loss and PDL
● Good uniformity
● Wide range operating wavelength
Applications:
● FTTH/FTTB/FTTC/CATV Network system
● PON (Passive Optical Network)
● Optical fiber equipment & system
Wafer Specifications:
PARAMETER :SPECIFICATION
Diameter : 6 inch (150±0.5mm)
Orientation : Flat 47.5±5mm
Thickness : 1050±100μm
Thermal Property : <150℃
Material : Quartz
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.