Silicon wafer

SHIJIA’s optical splitter wafer is developed by using planar light wave circuit technology. Its different channel is fabricated on the quartz through growing, lithography, etches and other process. The high reliable optical splitter chips can be obtained through lid glass bonding, cutting, grinding, and polishing process. Features: ● 6 inch size ● Low insertion loss and PDL ● Good uniformity ● Wide range operating wavelength Applications: ● FTTH/FTTB/FTTC/CATV Network system ● PON (Passive Optical Network) ● Optical fiber equipment & system Wafer Specifications: PARAMETER :SPECIFICATION Diameter : 6 inch (150±0.5mm) Orientation : Flat 47.5±5mm Thickness : 1050±100μm Thermal Property : <150℃ Material : Quartz