Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to the heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.
INDUSTRIES SERVED
Aerospace
aviation
automotive
electrical
electronics
appliance
defense
ammunition
marine
engineered plastics
heavy equipment
maintenance
energy and utilities
industrial assemblies
medical device assemblies
composites