Product Description
Hernon® Dissipator® 746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips.
Typical Applications
Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.
Typical Properties (Uncured)
Property Value
Chemical type Modified acrylic
Appearance White paste
Viscosity at 77ºF (25ºC), cP
at 2.5 rpm 500,000 to 1,000,000
at 5 rpm 300,000 to 800,000
Specific gravity 1.64
Flash point See SDS
Typical Properties (Cured)
Physical Properties
Property Value
Coefficient of thermal expansion,
ASTM D696 (K-1) 50 x 10-6
Coefficient of thermal conductivity, ASTM C 177, W/(m·K) 0.92
Temperature Range, ºC (ºF) -55 to 150 (-65 to 300)
Impedence Measurements
Specimens cured at 10:1 weight ratio with activator 15.
Mixed quickly for a few minutes and cured under compression for 24 hours at room temperature.