Polysulfide adhesive H-611
glassfor metaltwo-component

polysulfide adhesive
polysulfide adhesive
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Characteristics

Chemical composition
polysulfide
Type of substrate
for metal, glass
Number of components
single-component, two-component
Applications
for bonding
Working temperature

Max.: 60 °C
(140 °F)

Min.: -30 °C
(-22 °F)

Description

H-611 is a two component adhesive, based on glycidol epoxy resin, bisphenol A epoxy resin, low polysulfide rubber and modified amine curing agent. This adhesive has excellent bond ability, cures under room temperature, has a low creep and high insulation resistance. It is perfectly suitable for long-term fatigue tests at normal temperatures. The operating temperature for this adhesive is -30℃ up to +80°C. H-611 is suitable for most of strain gauges and compensation resistors. It is highly recommended for compensation resistors and terminal tabs and for bonding gauges in inconvenient or difficult places under normal temperature and pressure conditions.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.