Board-to-board connector ER8 Series
dataFPC/FFCbackplane

board-to-board connector
board-to-board connector
board-to-board connector
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Characteristics

Type
data
Format
FPC/FFC, backplane, SMT, board-to-board
Shape
parallel, straight, right-angle
Electrical characteristics
high-speed
Material
gold
Product applications
transmission
Domain
for industrial applications, for medical applications, for automation applications
Pitch

0.8 mm
(0.031 in)

Data rate

10 b/s

Operating temperature

Max.: 125 °C
(257 °F)

Min.: -55 °C
(-67 °F)

Description

[FunctionMAX PCIe Gen.4 High Speed Transmission (16+Gbps), 0.8mm Pitch, Board-to-Board Connectors PCIe Gen.4 High Speed Transmission (16⁺Gbps), 0.8mm Pitch, Board-to-Board Connectors 1. Pitch : 0.8mm 2. Variations : Right Angle / Parallel / Coplanar 3. Stacking Height : 7/9/10/12mm 4. Number of Positions : 10/20/30/40/50/60 70/80/100/120/140pos. 5. Large Guide for Easy Mating 6. Unique Contact Design for Smooth Mating 7. Samtec “Edge Rate®” Licensed Second Source In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information.

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