Optical glass anchor nut

Hobbite® Wafer (Corning Eagle XG Wafer) Hobbite can be provide to Corning Eagle XG Wafer, Capabilities depend on material and substrate size , actual capabilities for specific wafer available upon request . AttributeMeasurements DiameterΦ2″、Φ3″、Φ4″、Φ5″、Φ6″、Φ8″、Φ12″ Thickness0.2mm、0.3mm、0.4mm、0.5mm、0.7mm、1.0mm、1.5mm tolerance±0.02mm） Dimensional Tolerance+/- 0.02 Thickness Tolerance+/- 5μm Thickness Variation (TTV)< 0.01mm Flatness 1/10 Wave/Inch Surface Roughness (RMS)<1.5nm Scratch and Dig 5/2 Particle Size<5μm Bow/Warp<10μm The following describes the versatility within several of our key processes. For full details on the process, please contact us freely get more information. WAFER FABRICATION PROCESS Shape Cut Thin sheets are scribed, thick sheets are water jetted and blocks are wire sawn to begin the process with a wafer “blank”. CNC Edge Each wafer is individually edged on a Precision CNC Edge Grinding Station. Lapping As required, wafers are lapped to precise thickness or flatness. Polishing Double-side Commercial Polish removes subsurface damage and Super Polish creates a pristine finish. Cleaning We combine ultrasonics and megasonics on multiple cleaning lines which feed directly into a Class 100 Clean Room. Inspection In our Class 100 Optical Clean Room, we inspect to various quality levels under the appropriate lighting conditions. Packaging All wafers are packed in pre-cleaned containers, double bagged and vacuum sealed within the Class 100 Clean Room.