DRAM memory module H5WRAGESM8W-N8L

high-speed

Fastest DRAM with enhanced heat dissipation The Fastest DRAM solution SK hynix's 1ynm 16Gb HBM2E is the industry's fastest memory at 3.6Gbps in I/O speed, processing 460GB of data per second using 1,024 I/Os. With 36% better heat dissipation than the previous HBM2, our new HBM2E is a truly efficient memory with robust performance for your system. HBM Performance Trend SK hynix leads the HBM market with ambitious for even faster HBM solutions: Our HBM3, under development, will be capable of processing data at a rate of 819GB/s or higher with 6.4Gbps speeds per pin. With over 2x power efficiency for the same workload as DDR or GDDR, HBM reduces overall TCO – capturing the essence of our Memory ForEST* initiative. Thermal Improvement Our HBM2E has 36% better heat dissipation than HBM2, which allows it to stay on average 14 degrees celsius cooler under the same operating conditions. Up to 9x Bandwidth, 2x Gen-on-Gen Capacity Improvement Compared to the 2.4GB/s bandwidth of DDR5 and 64GB/s of GDDR6, HBM2E can perform up to 9x faster, processing 460GB of data per second. HBM2E also doubles the density over the previous-gen HBM2 by realizing a 16GB solution with a combination of eight 16Gb DRAM die, compared to the 8Gb core die density on the HBM2.