Storage meets processing in hybrid package
Expanding the Possibilities of Mobile
Our high-density eMCP is a combination of 3D V4 256Gb NAND flash-based 128GB eMMC5.1 and 1xnm 8Gb DRAM-based 6GB LPDDR4X, packaged into an area-efficient design with stable functionality. The package fits neatly inside a range of compact devices where portability and mobility are crucial, especially in smartphones, wearables, and connected IoT devices.
Meeting a Wide Range of Mobile Needs
Already widely used in mobile devices today, SK hynix's eMCPs continue expanding in diversity in line with the various density configurations of mobile applications.
Area-efficient Package
Our 128GB+6GB LPDDR4X eMCP realizes a faster speed of 4,266Mbps, in a package that is around 40% more area-efficient than using individual and discrete LPDDR and eMMC components.