Xtensa® LX6 dual-core computer-on-module iesy ESP32 OSM-0F

industrial

The smallest solder-on module from the OSM™ series is smaller than a standard stamp. The area of application is therefore clear - small for small. The focus here is primarily on various applications from the consumer electronics environment. But the “dwarf” also has its right to exist for tasks in the industrial environment. Despite its small size, the OSM™ Size-0 (Zero) does not have to hide.In terms of performance, it covers numerous core functions very well. In addition, the Size-0, like all Open Standard Modules™, offers the possibility to respond flexibly to requirements. Since the SGeT e.V. specification is based on the open source idea, other board configurations and thus other functionalities and performance levels are possible and also desired. We are happy to answer your questions. Description With its 15 mm x 30 mm, however, it is already a real all-rounder. It already offers numerous core functions that make the "iesy ESP32 OSM-0F" especially interesting for low space applications. Technical Data: Microcontroller: ESP32 Xtensa DualCore x32 LX6 Clock rate: 240 MHz RAM: 512 KB Flash memory: 32 Mbit SPI-Flash Dimension: 15 mm x 30 mm Footprint: OSM Size-0 Land Grid Array (LGA), Solder-on modules with 188 contact points Power supply: 3,3 V, +/- 5 % via LGA contacts Power consumption: <1 W (typ.) Temperature range: Operating: -40 °C to +80 °C / Storage -40 °C to +85 °C Software: Espressif IDE (FreeRTOS based) via PlatformIO