Automated die bonder RFX

high-accuracy

InduBond® RFX is the new system process and equipment that has been developed to improve the crucial factors associate with fabrication of complex multi layer PCBs rigid, rigid-flex and flex. This new generation of the InduBond® bonding machines can bond multiple number of bonding points in any location of the multi layer stack-up for best registration. The bonding points could be placed anywhere along the edges or inside the real state or circuit image area. Those bonding spots works as virtual pins to help the scale constrain, similar as multiple tooling pins around of single PCB. This machine is ideal for rigid, Rigid-Flex or Flex multi layer panels and can bond all the new laminated materials that you actually press. The bonding points can be place anywhere in the CAD design, the machine is capable to read and decode the Gerber file jobs and automatically know the coordinates of each bonding location on the panel. Four bonding heads with independent movement in X and Y axis allow to access to any location and provide fast speed for complex rigid-flex panels that require many bonding locations for best registration. The high accurate tooling template can be customize with 3 or 4 slot pins, round pins or a combination, they are light and removable from the machine, the stack-up can be lay-up at the machine or in a separate lay-up tables for more production. The automation for load and unload templates are also possible. All the improvements of our very well know InduBond® patented technology where realize: Less flexible layers dimensional distortion for better scale constrain. Better final thickness stability over the panel.