Automated die bonder PLR

high-accuracy

High precision layer to layer optical registration. Inductive Bonding Technology (InduBond®) to assure best registration. The bonding points withstand the movements of the inner layers during the hot press cycle. No post etch punching or post etch drilling process is necessary. Best registration accuracy with 8+4 CCD cameras system for the new optical alignment system. Inner layer front to back image registration and inner layer geometry shape measurement for quality control and statistic alignment compensation. High Cost reduction, not tooling holes process, not hard tools for inner layers registration. All the accumulated tolerances of the traditional post etch punch and pin lamination tools systems are eliminated. Four bonding heads working simultaneously and independent with X/Y movement to place bonding locations for fixing the registration prior to lamination in any location of the PCB. Bonding locations are loaded directly from the Gerber files. All laminates materials can be bonded (FR4, Htg FR4, Rogers, Polyamide...). Fully automated process. InduBond® PLR is the new equipment that has been developed to allow Pin Less Lamination of multilayers and also for sequential lamination built up technology. The complete registration process is made in the PLR unit: Lay-up the multilayer Stack-up, layer to layer optical registration and final welding to hold the registration. In the InduBond® PLR process the mechanical tolerances of the inner layers post etch punch or drill locations of the tooling holes,