Automated die bonder X1

high-accuracy

InduBond X1 Standalone Station.  Low friction solid table to move the registration tooling plate.  1 InduBond head last generation V3 with PTF film protection.  High pressure system up to 300PSI.  1 InduBond driver last generation V3.1 installed.  Laser light pointer to point where the center of bonding location is.  The head can bond / treat all standard materials as well high Tg. FR4, Rogers (4.000, 3000 series), Polyimid, halogen free, etc.  Allows to bond more than one multi-layer assembly at the same time up to the maximum pin height, if high production is required.  Tight mechanical alignment through Multiline slot pin system or standard round pins according customer requirements.  Simple and intuitive touch screen allows to set the bonding parameters.  Food switch for hands free and easy operation.  System comes in a kit format easy to assembly Operation Description. Operator build up the inner-layers assembly over the registration tooling plate (customizable). To place a weigh over the stack-up is recommended to keep assembly flat during the bonding process. Operator set the bonding cycle on the touch screen according the thickness, number of layers, slides the tooling plate to make to match the Laser pointer with the center of the desired bonding location. Once the panel is in the correct position, operator hits the pedal switch to begin the bonding cycle. Once the bonding cycle is over, the heads will open automatically, the unit is then ready for the next bonding cycle in a different location or in the same location.