Temperature monitoring system E-LIT

measurementfor the electronics industryinfrared camera

Elec­tronic / Semi­con­ductor Testing Solu­tion - E-LIT Modular Automated Test Bench • Thermal analysis of electronic and semiconductor devices • Modular test bench for online lock-in measurement • Reliable detection of thermal anomalies in the mK and μK range • Spatial location of defects in multilayer PCBs and multi-chip modules • Use of thermographic systems with cooled and uncooled detectors • Operational software IRBIS® 3 active with comprehensive analysis options in laboratory conditions E-LIT – Lock-In Thermography for electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure. The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK temperature differences are reliably detected by the Lock-in Thermography system. Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.