Reflow soldering oven VSU12

vacuumfor electronic componentsfor automotive applications

Infrared lamps placed under the tooling plate heat it up. The tooling plate has a square form with dimensions 100x100mm and can be made of any suitable material. It can also be prefabricated with custom openings for fixtures inside it. Tooling plate can be replaced together with the parts on it. This enables serial production. Nitrogen flow blows from the chamber bottom against the tooling plate and thus cools it down. The chamber itself is air cooled. Process environment - nitrogen, formic acid Maximum temperature - 350°C Heating area - 100 x 100 mm Heating plate - removable: graphite, aluminum, etc. Clearance above heating plate - 35 mm Heat up / cool down ramp - 120-150°C/min Control deviation - +/- 0.5°C Heating elements - 4x infrared heating lamps Heating control - common for all heaters Cooling of heating plate - nitrogen flow Temperature measurement - 1x fixed and 2x freely positional thermocouple K-Type Pressure measurement - integrated pressure transmitter Maximum vacuum - 5x10-2 mbar Formic acid bubbler - 40 ml container, integrated in front panel Cooling of chamber body - air cooling Lid viewing port - 34 mm Display - 7" LCD with touch screen PC Software - process logging, recipe transfer, etc. User interface - remote control over relay I/Os Dimensions - 330 mm(W) x 300 mm(D) x 443 mm(H) with open lid Weight - 12 kg Power supply - 1 phase / 190-240V, 50/60 Hz Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films,