Reflow soldering oven VSU20

vacuumfor electronic components

Programmable vacuum reflow soldering oven with heating area 200mm diameter. The vacuum reflow oven is equipped with a hot plate made of solid aluminum, coated with ceramics. Another water cooled plate is mounted beneath the hot plate. In time of cooling the cold plate is lifted up and pressed against the hot plate, thus cooling it quickly. This feature also enables cooling under vacuum. Maximum temperature - 400°C Heating area - ∅ 200 mm Heating plate - fixed: aluminum Clearance above heating plate - 50 mm Heat up / cool down ramp - 120-150°C/min Control deviation - +/- 0.5°C Heating elements - coil heaters integrated in heating plate Heating control - common for all heaters Cooling of heating plate - lifting up cold plate Temperature measurement - 1x fixed and up to 3x freely positional thermocouples K-Type Pressure measurement - integrated pressure transmitter Maximum vacuum - 5x10-2 mbar Formic acid bubbler - 40 ml container, integrated in front panel Cooling of chamber body - water/ethylene glycol - integrated chiller Lid viewing port - 80 mm Display - 7" LCD with touch screen PC Software - process logging, recipe transfer, etc. User interface - remote control over relay I/Os Dimensions - see layout Weight - 35 kg Power supply - 1 phase / 190-240V, 50/60 Hz