Reflow soldering oven VSU28

vacuumfor electronic components

Programmable vacuum reflow soldering and brazing oven with heating area 260x210mm. Infrared lamps placed under (or optionally, also above) the tooling plate heat it up. The tooling plate in a rectangle form with dimensions 260x210mm can be produced of any suitable material also with custom openings for fixtures inside it. Design enables loading of tooling plate inside the chamber together with the parts on it - suitable for serial production. Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate. The chamber itself is water cooled. External water chiller is required, if not ordered with mounting rack MR23CP. Process environment - nitrogen, inert gas, formic acid, forming gas Maximum temperature - 650°C Heating area - 260 x 210 mm Heating plate - removable: graphite, aluminum, etc. Clearance above heating plate - 50mm with single / 60mm with double heating Heat up / cool down ramp - 250°C/min Control deviation - +/- 0.5°C Heating elements - 8x/16x infrared heating lamps in one or two rows Heating control - individual/adjustable on every heating lamp Cooling of heating plate - nitrogen flow Temperature measurement - up to 4x thermocouples K-Type freely positional Pressure measurement - integrated pressure transmitter Maximum vacuum - 5x10-2 mbar Formic acid bubbler - 40 ml container, integrated in front panel Cooling of chamber body - water/ethylene glycol mixture Lid viewing port - 80 mm / not available with double heating Display - 7" LCD with touch screen PC Software - process logging, recipe transfer, etc. User interface - remote control over relay I/Os Dimensions - see layout