Hot melt glue application head LPT/UFD™

Hot melt glue application head - LPT/UFD™ - ITW Dynatec
Hot melt glue application head - LPT/UFD™ - ITW Dynatec
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hot melt glue

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Lamiated Plate Technology with Uniform Fiber Deposition - some companies say that they innovate, but only ITW Dynatec has the patents to prove it. (5,902,540 - 5,882,573 - 5,904,298) Overview Don’t Be Fooled ITW Dynatec® has been the leading innovator in the hotmelt application industry for years. It should come as no surprise, then, that only our Fiberized Technology can meet any demand your application has. Unmatched Technology, Unmatched Results Thanks to our patented Laminated Plate Technology, no competitor can match the results of ITW Dynatec’s UFD fiberized spray applicators. The stainless steel laminated plate construction is the most durable nozzle construction on the market, and the patented nozzle configuration is the only configuration that allows the production of the Omega™ adhesive fiber pattern. Use the Best, Save the Most This patented Omega™ fiber pattern provides between 20 and 60% adhesive savings over spiral spray or melt-blown techniques due to larger, more controlled adhesive filament. UFD™ fiberized spray technology from ITW Dynatec is also less expensive in the long run over conventional coating and laminating techniques.

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