Transistor outline (TO) package test socket GD17-TOLL-x-xx

burn-inKelvin

For TOLL(TO-Leadless) Package Test Socket Clamshell Type It can be used for testing space-saving and high-power surface-mounted devices, TOLL (leadless). You can choose from with or without flange. - Kelvin Contact (option) - For Burn-in Test - For evaluation/Verification [Application] Server/Solar,Micro-Inverter/Switch Power Supply for 5G Communication/Drone/Home Automation ** Including terminal temperature rise. - Thru holes GK,DK,SK are for Kelvin contact. If Kelvin Contact is not required,these holes are not necessary. - Without Flange type (P/N:GD17-TOLL-x-NFL) does not require 2-φ2.5 holes. Generally,TOLL(TO-lead less) package size is specified. However, the size depends on the semiconductor manufacturers and devices. If you send us your device in advance,we can properly confirm its adoption. In order to use the test socket for a long time, we recommend regular cleaning. Please contact us if you would like guidance on maintenance methods.