Transistor outline (TO) package test socket GD25-HU3PAK-x-S141X142

burn-inKelvin

TO Package Test Socket For HU3PAK Size 25x36.9mm / 0.984x1.453" This socket can be used for testing HU3PAK devices. HU3PAK is a device with excellent heat dissipation and can handle high current. - Kelvin Contact (Option) - For Burn-in Test - For evaluation/Verification [Applications] Charging stations, power units, etc.