3.5" motherboard MF10 Series
11th Generation Intel® Core™11th Gen Intel® Tiger Lake-UP3 i5-1145G4EIntel® Core™ i5-1135G7

3.5" motherboard
3.5" motherboard
3.5" motherboard
3.5" motherboard
3.5" motherboard
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Characteristics

Format
3.5"
Processor
11th Generation Intel® Core™, 11th Gen Intel® Tiger Lake-UP3 i5-1145G4E, Intel® Core™ i5-1135G7
Chipset
Intel®
Memory
DDR4 DRAM
Extension slot
SATA3, M.2
Applications
industrial, embedded
Operating system
Linux, Windows 10, Windows 11
Memory frequency
DDR4 3200 MHz
Connectivity
gigabit Ethernet, USB 2.0, HDMI, RJ45, USB 3.2, RS-232, DisplayPort

Description

11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays, M.2 PCIe 4.0 x4 supports NVMe, 1* COM, 3* USB3.2 (Gen2), 2* USB Type-C, 1* 2.5GbE, 1* GbE 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM 1.0GbE, 1* Intel i225V 2.5GbE 4. 2* HDMI, 2* DP1.4 (from Type-C), 1* eDP 5. 1* RS232, 3* USB3.2 (Gen.2), 5* USB2.0, 2* USB 3.2 (Gen. 2) Type-C support DP1.4 display output 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4/SATA interface support NVMe, 1* SATAIII (6Gb/s) 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi, 1* M.2 B-Key 3042/3052, USB3.1/USB2.0/PCIe x1 interface 8. Onboard TPM 2.0 (option) 9. 12~24V DC-in Market Segments Supported √ Edge Computing √ Industrial PCs √ Digital Signage √ Factory Automation √ AI Inference √ Retail Solution Environment Operating Temperature : 0 ~ 60°C Storage Temperature : -20 ~ 85°C Humidity: 10% ~ 90% RH @40°C (non-condensing)

Catalogs

Exhibitions

Meet this supplier at the following exhibition(s):

embedded world North America

8-10 Oct 2024 Texas (United States) Stand 2537

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