11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays or 1* 8K SDR Displays, M.2 PCIE 4.0 x4 supports NVME, 4* COM, 4* USB3.2(Gen2), 1* 2.5GbE, 1* GbE
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W)
2. 2* DDR4-3200MHz SO-DIMM up to 64GB
3. 1* Intel® i219-LM 1.0GbE, 1* Intel i225-V 2.5GbE
4. 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS
5. 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0
6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME
7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi
8. 1* SATAIII (6Gb/s)
9. Onboard TPM 2.0 (option)
10. DC-in 12-24V
Market Segments Supported
√ Digital Signage
√ Industrial PCs
√ Edge Computing
√ Factory Automation
√ AI Inference
√ Retail Solution
Environment
Operating Temperature : 0 ~ 60°C
Storage Temperature : -20 ~ 85°C
Humidity: 10% ~ 90% RH @40°C (non-condensing)