Intel® 11th Gen. Tiger Lake UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE
1. Intel® Tiger Lake UP3 SoC Processor (TDP 12~28W)
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 2* Intel i225-V 2.5GbE
4. 1* VGA, 1* HDMI2.0b, 1* eDP, 1* 24 bits LVDS
5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1) 2* USB2.0
6. 1* M.2 M key (2242/2280), 1* M.2 E key(2230), 1* M.2 B key (3042/3052), 1* SATAIII (6Gb/s)
7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI Ex1)
8. Onboard TPM 2.0 (option)
9. 12~24V DC in
Market Segments Supported
√ Panel PC
√ SCADA system
√ KIOSK
Environment
Operating Temperature : 0 ~ 60°C
Storage Temperature : -20 ~ 70°C
Humidity: 10% ~ 90% RH @40°C (non-condensing)