Pulsed fiber laser marking machine 166 series
waferbarcodeautomatic

pulsed fiber laser marking machine
pulsed fiber laser marking machine
pulsed fiber laser marking machine
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Characteristics

Technique
pulsed fiber laser
Applications
barcode, wafer
Other characteristics
automatic, traceability

Description

High Precision 2DBC Laser-marking Machine designed and customized for specific wafer or FPC Software developed & tailor-made to suit end-user requirements 2DBC generated by and uploaded to the server User-friendly interface for easy operation, authority-level operator, technician & engineer High precision alignment & marking, +/-30μm, High repeatability with CPK>1.33 Laser-safety with door-lock, ionizer to remove static, Fully automation with high UPH ( 3-4K for Flex, 6K-8K for Wafer PCBA) Introduction It is marking μm-precision 2D barcode (2DBC) with pulsed-laser. The 2DBC is for product traceability. This machine has integrated onloading & offloading, global/local alignment, marking & inspection. Fully automation delivers high UPH.

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Exhibitions

Meet this supplier at the following exhibition(s):

JIMTOF 2024
JIMTOF 2024

5-10 Nov 2024 Tokyo (Japan)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.