Vacuum deposition service

Ramtech has developed a RAM cathode for use in four face target sputtering method, which enables the deposition of high-quality thin film. The RAM cathode features low damage, low temperature deposition, and a smooth surface with few pinholes and other defects. RAM cathode is used in various fields such as perovskite solar cells and OLED. Our lab room is equipped with cluster sputtering system equipped with RAM cathode and is available for deposition tests on substrates supplied by our customers. Achieve low-damage sputtering In the conventional flat plate sputtering method, sputtering flux and recoil argon from the target collide directly with the substrate, resulting in very large damage during deposition. By depositing the film with a RAM cathode, flux do not directly hit the substrate and the sputtering flux are uniformly rained down, so the film can be deposited with minimal damage. High quality thin film deposition is possible The sputtering flux scattered from opposing targets collide with each other, which promotes the refinement of the sputtering flux. The uniform deposition of fine flux results in a smooth surface and the formation of a film without few pinholes. Realization of High Step Coverage In conventional sputtering, the surface parallel to the target is the main deposition surface. By changing the film deposition conditions with RAM cathode and using sputtering flux scattered diagonally, it is possible to effectively to deposition on the side surface with >85% thickness (compared to the film thickness) . The RAM cathode can be used in a wide range of processes depending on the conditions.