Substrate for the electronics industry ATS

ceramic

Alumina thin film substrates This zirconia thoughened alumina substrate material shows very good results after laser scribing and breaking, or even when cut with a waver saw. ATS is especially for thinfilm applications. ATS can be easily cutted or structured by laser or waver saw. Due to its inner mechanical strength and fine grains the material has much less material chipping at the processing edges during manufacturing process compared to other materials. Due to the very fine grains of the ATS very fine Pt-structures are possible. We lasercut the material according to your wishes! Please send in your CAD data. Advantages very fine-grained homogeneous grain structure < 1 micron good electrical insulation properties high mechanical strength processing by laser or waversaw possible, very low on chipping very good evenness outstanding performance for thinfilm applications Main Applications thinfilm application, e.g. temperature sensors