Base materials
Cu-ETP1
Of-Cu
Ag
Other materials on request
Dimensions
Thickness: 0,025 - 0,40 mm
Width: 0,20 - 24,00 mm
Coatings
Sn
Ag
Au
To customer requirements
Process
Processing of electroplated round wires to flat wires
Strengths
All strengths from soft to hard available