Multilayer printed circuit board SLP

16 layers

Electronic products such as smartphones, tablets and wearable devices are becoming increasingly intelligent, thin and functional. Kinwong actively studies this technology trend, and invests in the construction of Zhuhai Substrate-like-PCB and IC Packaging substrate factory, so as to achieve technological breakthroughs such as more stacking layers, smaller line width and line spacing, and multi-function modules. Zhuhai SLP mainly produces anylayer, IC substrates and substrate-like PCBs which up to 16 layers, they are ideal for consumer electronics (such as mobile phones, wearables, tablets, cameras, notebooks ), Internet of Things, industrial control and automotive electronics and other applications. mobile phone and consumer high step HDI boards, IC package substrates, automotive HDI, ≥100G communication optical module boards and substrate-like-PCBs. The main material: low dielectric constant, low loss, low expansion coefficient material application Process: subtractive process, mSAP process, amSAP process Minimum laser hole diameter: 50um Minimum solder mask opening: 80um Minimum line width/spacing: 30/30um