e-Beam Wafer Defect Review and Classification Systems
The eDR7380™ electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. With a wide range of electron optics and a dedicated In-Lens Detector, the eDR7380 supports defect visualization across process steps, including fragile EUV lithography layers, high aspect ratio trench layers and voltage contrast layers. Unique Simul™-6 technology produces a complete DOI pareto in one test for accurate defect sourcing and faster excursion detection. With connectivity features, such as IAS™ for broadband optical patterned wafer inspectors and OptiSens™ for bare wafer inspectors, the eDR7380 provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.
Applications
Defect imaging, Automatic inline defect classification and performance management, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Hotspot discovery, Defect discovery, EUV print check, Process window discovery, Process window qualification, Bevel edge review.
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eDR7280: Electron-beam wafer defect review and classification system with fifth-generation e-beam immersion optics for ≤16nm design node IC development and production.