Critical dimension measuring system SpectraShape™ series

dimensionalopticalintegrated circuit

Optical Critical Dimension (CD) and Shape Measurement Systems The SpectraShape™ 10K dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of finFETs, vertically stacked NANDs and other complex features on integrated circuits at the 1Xnm design nodes and beyond. Using a diverse array of optical technologies and patented algorithms, the SpectraShape 10K optical CD and shape measurement system provides feedback on critical device parameters (critical dimension, metal gate recess, high k recess, side wall angle, resist height, hard mask height, pitch walking) for a broad range of applications across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers. Applications Inline process monitor, Patterning control, Process window expansion, Process window control, Advanced Process Control (APC), Engineering analysis Related Products AcuShape®: Advanced modeling software that interprets the signals from SpectraShape systems, helping to accelerate the process of building robust, usable 3D shape models. SpectraShape 10K: Optical CD and shape metrology systems enabling measurement of complex features for 1Xnm logic and advanced memory IC devices. SpectraShape 9000: Optical CD and shape metrology systems enabling measurement of complex features for IC devices at the 20nm and below design nodes.