Thickness measuring system Aleris® series

spectroscopicfor film

Film Metrology Systems The Aleris® film metrology systems provide reliable and precise measurement of film thickness, refractive index, stress and composition for the 32nm node and beyond. Utilizing Broadband Spectroscopic Ellipsometry (BBSE) technology, the Aleris film metrology systems form a comprehensive film thickness measurements and metrology solution, helping fabs to qualify and monitor a broad range of film layers. Aleris 8330 The Aleris 8330 film metrology system is a low cost-of-ownership solution for non-critical films, including inter-metal dielectrics, photoresists, bottom anti-reflective coatings, thick oxides and nitrides, and back end of line layers. Aleris 8350 The Aleris 8350 is a high-performance film metrology system that meets the tighter process tolerances required for thickness, refractive index and stress measurements on critical films. The Aleris 8350 film thickness measurement system is used for advanced film development, characterization and process control for a wide range of critical films, including ultra-thin diffusion layers, ultra-thin gate oxides, advanced photoresists, 193nm ARC layers, ultra-thin multi-layer stacks, and CVD layers. Aleris 8510 The Aleris 8510 extends the Aleris Family’s film thickness measurements, composition, and stress measurement capability to advanced high k metal gate (HKMG) and ultra-thin decoupled plasma nitridation (DPN) process layers. Utilizing enhanced 150nm Broadband Spectroscopic Ellipsometry technology, the Aleris 8510 film thickness measurement system provides engineers with the film metrology data required for development and inline monitoring of DPN layers and all HKMG layers – from gate through