Temperature measuring system EtchTemp series

for wafers

The EtchTemp Series of in situ wafer temperature measurement systems captures the effect of the plasma etch process environment on production wafers. The EtchTemp-SE measurement system includes a protective coating, enabling temperature monitoring during silicon plasma etch processes. By characterizing thermal conditions that closely represent product wafer conditions, the EtchTemp-SE wireless wafer assists process engineers with tuning of the etch process conditions, and the qualification, matching and post-PM verification of front end of line plasma etch chambers. Applications Process development, Process qualification, Process tool monitoring, Process tool qualification, Chamber matching, Process tool matching Dielectric plasma etch (EtchTemp), Conductor plasma etch (EtchTemp-HD, EtchTemp SE-HD, EtchTemp-SE), Ion implant | 20-140°C Related Products EtchTemp-HD Temporal and spatial temperature data under real process conditions for characterization of multiple zone electrostatic chuck (ESC) wafer processes. EtchTemp-LT Temporal and spatial temperature data under real process conditions for characterization of wafer etch processes below 20°C EtchTemp-HP Temporal and spatial temperature data under real process conditions for characterization of high total power, high aspect-ratio contact (HARC) etch wafer processes EtchTemp-SE Temporal and spatial temperature data under real process conditions for characterization of high-power, high-frequency silicon etch wafer processes EtchTemp Temporal and spatial temperature data under real process conditions for characterization of high-power, high-frequency dielectric etch wafer processes