In Situ Film Deposition Wafer Temperature Measurement System
The HighTemp-400 in situ wafer temperature measurement system is designed to optimize and monitor advanced film processes (FEOL and BEOL ALD, CVD and PVD) and other elevated temperature processes. The HighTemp-400 wireless wafer measures process tool thermal uniformity, providing temporal and spatial temperature data collected under real production process conditions. By revealing thermal variations that can affect process windows and patterning performance, the HighTemp-400 helps IC manufacturers with the integration of new materials, transistor technologies and complex patterning techniques.
Applications
Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching
Thin film deposition | 20-400°C