Optical inspection system Teron™ SL6xx series

automaticsurface defectfor wafers

The Teron™ SL670e XP inspection system is used to assess incoming EUV reticle quality and to re-qualify EUV reticles periodically during production use and after reticle cleaning, helping chipmakers protect yield by reducing the risk of printing defective wafers. With innovative EUVGold™ and EUVMultiDie technologies, advanced focus tracking, and imaging flexibility, the Teron SL670e XP delivers the sensitivity required to monitor and detect yield-critical reticle defects on EUV reticles used for 5nm/3nm logic and advanced DRAM chip production. The Teron SL670e XP also has industry-leading production throughput, supporting the fast cycle times needed to qualify reticles during high-volume chip manufacturing. Inspection of advanced optical reticles is supported on the Teron SL670e XP with an option. Reticle re-qualification, Incoming reticle quality check Teron™ SL670e: Inspection of EUV and optical (optional) reticles during chip manufacturing for 7nm/5nm design node IC technologies. RA (Reticle Analyzer): Reticle data analytics system for IC fabs supports applications such as automatic defect classification, lithography plane review and defect progression monitoring. Teron™ SL655: Inspection of optical and EUV (optional) reticles during chip manufacturing for 10nm design node IC technologies. Teron™ SL650: Inspection of optical reticles during chip manufacturing for 20nm design node IC technologies.