Optical inspection system ICOS™ T3/T7

3D2DAI

The ICOS™ T3/T7 Series delivers multiple options for fully automated optical inspection of packaged integrated circuit (IC) components with tray (T3) or tape (T7) output. The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality. For the most accurate component sorting process, the ICOS T3/T7 Series utilizes Artificial Intelligence (AI) systems with deep learning algorithms to enable smart and agile binning of defect types. The ICOS T3 and T7 inspectors share a common platform, enabling reconfiguration from tray to tape output for optimal tool use in a changing environment. Applications Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)