3D inspection system Kronos™ 1190

AIautomaticfor the packaging industry

The Kronos™ 1190 patterned wafer inspection system with high resolution optics provides best in class sensitivity to critical defects for process development and production monitoring in advanced wafer-level packaging (AWLP) applications including 3D IC and high-density fan-out (HDFO). DefectWise™ integrates Artificial Intelligence (AI) as a system level solution, delivering a large boost in sensitivity, productivity and classification accuracy to address the challenges of overkill and defect escapes. DesignWise™ refines the FlexPoint™ precisely targeted inspection areas with direct design input to further reduce nuisance. Supporting bonded, thinned, warped and diced substrates, the Kronos 1190 system enables cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, patterning of Cu pads, Cu pillars, bumps, through silicon vias (TSVs) and redistribution layers (RDL). Applications Defect discovery, Process debug, Process monitor, Tool monitor, Outgoing Quality Control (OQC)