Shape measuring system Axion® T2000

dimensional3DX-ray

The Axion® T2000 X-ray dimensional metrology system produces high resolution, fast, accurate, precise, non-destructive 3D shape measurements of the high aspect ratio structures used in advanced 3D NAND and DRAM chips. Leveraging innovative X-ray technology, the Axion T2000 identifies subtle structural variations (bending, bowing, CD profile, etch depth, ellipticity, tilt, and more) that can impact memory device performance and yield. With measurements made inline, non-destructively, the Axion T2000 helps memory manufacturers achieve fast cycles of learning during R&D, serving as a replacement for long lead time, destructive methods, such as FIB-SEM, TEM and cross-section SEM. The Axion T2000 is also used to characterize, monitor and control key process steps during high volume manufacturing, ensuring issues are identified and addressed quickly to maintain stable production. Applications Process characterization and optimization, Engineering analysis, Inline process monitoring, Etch process tool monitoring, Post-PM etch process tool qualification