High Productivity Patterned Wafer Broad Range Inspection Systems
The 8 Series patterned wafer inspection systems detect a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The 8 Series provides cost-effective defect monitoring for chip manufacturing using 150mm, 200mm or 300mm silicon, SiC, GaN, glass and other substrates, from initial product development through volume production. The latest generation 8935 inspector employs new optical technologies and DesignWise® and FlexPoint™ precise area inspection techniques to capture critical defects that can cause chip failures. DefectWise® AI technology enables fast, inline separation of defect types for improved defect discovery and binning. With these innovations, the 8935 supports high productivity capture of yield and reliability-related defects at a low nuisance rate, helping chip manufacturers accelerate delivery of their products—reliably and at lower cost. The 8 Series inspectors support defect monitoring during fabrication of a broad range of leading-edge and legacy node device types, including logic, memory, power devices, LED, photonics, RF devices and MEMS. The 8 Series systems also support quality control during production of AR/VR lenses and hard disk drive (HDD) manufacturing.
Applications
Process monitor, Tool monitor, Outgoing Quality Control (OQC)