Epoxy adhesive TUF 1613 HT-SM

for metalfor plasticsglass

Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1613 HT-SM offers an extensive serviceable temperature range. This product can withstand severe thermal cycling and shocks. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. TUF 1613 HT-SM is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1613 HT-SM also offers very good thermal conductivity. It offers very smooth paste like consistency and does not tail when dispensed. It has a tan – brown color and it can be color matched to your specifications. With an ideal dispensing profile, TUF 1613 HT-SM although most commonly used for surface mount applications, its superior performance also makes it suitable for use in various other electronics, aerospace and distinctive OEM applications. Product Highlights Thermally conductive Low ionic content Extremely fast cure Outstanding dimensional stability Superb electrical insulator Unlimited working life at room temperature Typical Applications Surface Mount Bonding Sealing