Epoxy adhesive KB 1085-1
for metalfor plasticsglass

Epoxy adhesive - KB 1085-1 - Kohesi Bond - for metal / for plastics / glass
Epoxy adhesive - KB 1085-1 - Kohesi Bond - for metal / for plastics / glass
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, glass, for ceramics
Number of components
two-component
Technical characteristics
electrically-conductive, chemical-resistant, water-resistant
Applications
for electronics, for bonding, sealing, for coating, for OEM
Working temperature

Min.: -50 °C
(-58 °F)

Max.: 120 °C
(248 °F)

Description

Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1085-1 offers a volume resistivity of 50 – 100 ohm-cm. This makes it ideal for static dissipation, grounding and EMI/RFI shielding applications. Being graphite filled, this product is non-magnetic in nature and offers slight lubricity. It offers an extensive serviceable temperature range. It is a phenomenal adhesive that offers superb physical strength properties and adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical, it also offers astounding chemical resistance to a variety of acids, bases, oils and water. Part A and Part B are black in color. Owing to its versatile performance, KB 1085-1 is widely used in electronics, aerospace, semiconductor, microwave and many OEM applications where a non-metallic conductive epoxy is required. Product Highlights Graphite filled electrically conductive Non-magnetic Offers good lubricity Ideal for static dissipation and grounding First-rate dimensional stability Very good shielding against EMI/RFI Typical Applications Bonding Sealing Coating

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TWO COMPONENT

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