Epoxy adhesive KB 1040 AOHT
for metalfor plasticsglass

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
for metal, for plastics, glass, for ceramics
Number of components
two-component
Technical characteristics
low outgassing, electrically insulating, thermally-conductive, chemical-resistant, water-resistant
Applications
for electronics, for bonding, sealing, for coating, for OEM, optical
Working temperature

Max.: 200 °C
(392 °F)

Min.: -50 °C
(-58 °F)

Description

Kohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1040 AOHT offers an extensive serviceable temperature range. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. It offers first-rate compressive strength of over 20,000 psi at room temperature. KB 1040 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of solvents, oils and water. Part A has an off-white color and Part B has a clear color. Owing to its high thermal conductivity and very low CTE, KB 1040 AOHT is widely used in electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities. Product Highlights Very high thermal conductivity Low coefficient of thermal expansion Superior dimensional stability Outstanding physical strength properties Exceptional electrical insulation properties Very good flowability Typical Applications Bonding Sealing Coating Encapsulation Potting

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TWO COMPONENT

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