- Materials - Tools - Components
- Semi-finished products
- Brazing paste
- Koki Company Limited
Solder paste S3X58-G803
Add to favorites
Compare this product
Characteristics
- Function
- solder
Description
Ensures stable and ultra low voiding regardless of component type and reflow profiles
Concerns with Voiding
Voids remained inside the solder joint affect the joint quality in various aspects.
Product Performance Table
Product Name - S3X58-G803
Product Category - Solder Paste
Composition - Sn 3.0Ag 0.5Cu
Melting Point(℃) - 217 - 219
Particle Size（μm） - 20-38
Viscosity（Pa.s） - 200
Flux Content(%) - 11.8
Halide content(%) - 0
Flux Type - ROL0（IPC J-STD-004）
Catalogs
No catalogs are available for this product.
See all of Koki Company Limited‘s catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.