Solder paste S3X58-M500C-7

for metalfor heat exchangers

Good and Consistent Wetting Spreading to Oxidized Metal Surface. Activator Technique After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting. Solder Spreading Property After continual print, pause 45 min. or 60 min. and resume printing and observe print volume. Test condition ・ Stencil : 200μm / 6.5mmφ aperture ・ Pre-conditioning : 150ºC for 16Hr ・ Heat source : Convection reflow ・ Reflow : Air Product Performance Table Product Name - S3X58-M500C-7 Product Category - Solder Paste Composition - Sn 3.0Ag 0.5Cu Melting Point(℃) - 217-219 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 200 Flux Content(%) - 11.8 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004) Optical Powder Size（μm） - 0