Solder paste S3X58-HF912

Solution for the Splattering in Reflow Soldering Mechanism of Flux Splattering & Anti-Splattering Technique In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around. S3X58-HF912, in contrast, forms a flux layer on the surface of the molten solder and prevents splattering of flux or flux with solder while soldering. Flux Splattering Test The conventional solder pastes requires high pre-heat temperature to evaporate volatile flux components which helps reduce the splatters during the reflow. S3X58-HF912 successfully conforms to various reflow profiles thereby eliminating the need to increase the pre-heat temperature to prevent occurrence of the flux splatters during the reflow. Product Performance Table Product Name - S3X58-HF912 Product Category - Solder Paste Composition - Sn 3.0Ag 0.5Cu Melting Point(℃) - 217-219 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 190 Flux Content(%) - 11.5 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004A)