Solder paste S3X811-M500-6

for metal

Preventing Solder Powder Degradation Application of 0201/03015 Components and Future Projection Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module. In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased. Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected. Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability. Product Performance Table Product Name - S3X811-M500-6 Product Category - Solder Paste Composition - Sn 3.0Ag 0.5Cu Melting Point(℃) - 217-219 Particle Size（μm） - 5-20 Viscosity（Pa.s） - 200 Flux Content(%) - 11.4 Halide content(%) - 0 Flux Type - ROL0(IPC J-STD-004B)